The Summer 2010 TOPAS Newsletter

It's been a busy time for us at TOPAS Advanced Polymers this year. We have several new products under development, one of which is featured below. We are launching activities in exciting new markets. Our customers are reporting better economic conditions and proceeding more aggressively with product introductions. But we are not too busy to talk with you.
Whether you are an existing customer with some new ideas, or whether TOPAS is new to you, please pick up the phone and give us a call. We're here to help you succeed by eliminating the compromises and frustrations of working with ordinary materials.

  - Timothy Kneale, President, TOPAS Advanced Polymers, Inc.

High Shrink Polyolefin Films Begin Here...

TOPAS COC resins are already recognized as the best solution for creating all-olefin films with high shrinkage. Now, the TOPAS R&D team has engineered another very useful product for shrink applications. Newly commercialized TOPAS 9903D-10 features a very low glass transition temperature (33C/91F), enabling design of blown or oriented films with even higher shrinkage at lower temperatures.
This resin can be used as a blend component with PE or other TOPAS grades, or as part of multilayer film structures. Especially in bottle label applications, where recycling systems are designed around olefin labels, an all-olefin film with TOPAS can improve overall package recyclability and deliver a more sustainable offering as shown in this presentation. If you are interested in boosting the performance of your shrink films, please contact us today!

TOPAS® COC for Electronics? It's a Secret.

Most polymer experts are already aware of the ways TOPAS COC can enhance packaging and medical products. But did you know that TOPAS resins are also valued for their unique electrical properties? The PTFE-like dielectric coefficient and tan delta of TOPAS resins, its high glass transition temperature, the ability to blend and enhance ordinary polyethylene and polypropylene resins...all enabling applications as diverse as printed circuit boards, mobile antennas, wire and cable insulation, radomes and more.
TOPAS resin is used to produce the high temperature fiber developed by Innegrity LLC that can replace part of the glass fiber in FR4 board resulting in a lighter weight circuit board with improved electrical performance. TOPAS COC enhanced polyolefin insulating foams are more rigid and thermoform better, while high temperature TOPAS grades can push performance beyond what is usually expected of polyolefins. To talk (quietly) about how TOPAS COC can enhance your electronic designs, call Randy Jester at extension 4409.

New Syringes with TOPAS® COC

Syringe photo   For the first time, a North American manufacturer is offering a line of syringes made from TOPAS® COC. Plas-Tech Engineering has developed prefillable syringes from TOPAS 6013, one of several TOPAS grades that pass stringent USP Class VI and ISO 10993 testing requirements. These clear barrier syringes, already in commercial use, are far less prone to breakage than glass, while delivering higher purity and better dimensional tolerances. With TOPAS COC, Plas-Tech captures the unparalleled design flexibility of plastics, plus the minimal reactivity and low active ingredient adsorption that only a cyclic olefin can deliver.

TOPAS® COC at K 2010

K show logo   If you plan to attend the world's largest plastics exhibition, the triennial K 2010 in Düsseldorf, Germany this fall, please stop by our booth! We will be in Hall 8a, Booth C28. This expo featuring vendors from across the globe runs from October 27 thru November 3. We will be posting show-related info in the K 2010 directory online, as well as our own K 2010 web pages. Representatives from Europe and North America will be on hand to discuss your applications and help find a solution to your toughest materials challenges. Please make an appointment today!

Meet The TOPAS Team At Upcoming Events

Medical Grade Polymers, Philadelphia, 14 - 15 September 2010: Meet us there
SPE Thermoforming Conference, Milwaukee, 18 - 20 September 2010: Meet us there
K 2010, Düsseldorf, 27 October - 03 November 2010: See our K web pages, then meet us there



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